EP2SGX30DF780C5N vs EP2SGX30DF780C4 Comparison

Detailed side-by-side comparison of EP2SGX30DF780C5N by Intel and EP2SGX30DF780C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX30DF780C5N EP2SGX30DF780C4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy End of Life
Series Stratix® II GX —
Family Name Stratix II GX —
Logic Elements / Cells 33,880 —
LABs / CLBs 1,694 —
Total RAM Bits 1,369,728 —
User I/O Count 361 —
Package Type FC-FBGA-780 —
Package Size 29 mm x 29 mm —
Ball Pitch 1.0 mm —
Operating Temperature -40°C to +85°C (extended commercial) —
Core Voltage 1.2 V 1.2 V
Internal Frequency (max) 622 MHz —
Process Technology 90 nm CMOS 90 nm CMOS
RoHS Status Compliant (lead-free finish) Compliant (per manufacturer product page)
Mounting Type Surface Mount Surface Mount
MSL Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Speed Grade C5 —
Design Tool Quartus II —
Family — Stratix II GX
Logic Elements — 33,880
Logic Cells — 33,880
Number of LABs / CLBs — 1,694
Total Number of I/Os — 361
Maximum Operating Frequency — 717 MHz
Number of Transceivers — 20 (embedded multi-gigabit)
Package — FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch)
Operating Temperature Grade — Commercial (C4)
Programmable Terminals — BGA ball grid (780 terminals)
Package Code — BGA
Package Shape — Square
Lead-Free — Yes

Datasheets & Resources

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