EP2SGX30DF780C5N vs EP2SGX30DF780I4 Comparison
Detailed side-by-side comparison of EP2SGX30DF780C5N by Intel and EP2SGX30DF780I4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel
EP2SGX30DF780C5N ⚠ Last Time BuyIntel
EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
EP2SGX30DF780I4 ⚠ Last Time BuySpecification Comparison
| Parameter | EP2SGX30DF780C5N | EP2SGX30DF780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Last Time Buy |
| Series | Stratix® II GX | Stratix II GX |
| Family Name | Stratix II GX | — |
| Logic Elements / Cells | 33,880 | 33,880 |
| LABs / CLBs | 1,694 | — |
| Total RAM Bits | 1,369,728 | 1,369,728 |
| User I/O Count | 361 | 361 |
| Package Type | FC-FBGA-780 | — |
| Package Size | 29 mm x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature | -40°C to +85°C (extended commercial) | -40C to +85C (Industrial) |
| Core Voltage | 1.2 V | — |
| Internal Frequency (max) | 622 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| RoHS Status | Compliant (lead-free finish) | [DATA_NEEDED: RoHS status] |
| Mounting Type | Surface Mount | Surface Mount (Flip-chip BGA) |
| MSL Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Speed Grade | C5 | — |
| Design Tool | Quartus II | — |
| Family | — | Stratix II GX |
| Number of LABs | — | 1,694 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Nominal Supply Voltage (Core) | — | 1.2 V |
| Internal Operating Frequency | — | 622 MHz |
| Maximum Clock Frequency | — | 717 MHz |
| Package | — | 780-ball FC-FBGA, 29x29 mm, 1 mm pitch |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Number of Transceivers | — | [DATA_NEEDED: number of transceiver channels] |
| Number of PLLs / DLLs | — | [DATA_NEEDED: number of PLLs] |