EP2SGX90EF1152C3ES vs EP2SGX90EF1152C4N Comparison

Detailed side-by-side comparison of EP2SGX90EF1152C3ES by Intel and EP2SGX90EF1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX90EF1152C3ES EP2SGX90EF1152C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Last Time Buy
Family Stratix II GX Stratix II GX
Process Node 90 nm 90 nm
Logic Elements 90,960 —
Embedded Memory 4,520,448 bits (approx. 4.5 Mbit) —
User I/O Pins 558 —
Package 1152-BBGA (FineLine BGA, 35x35 mm) 1152-BBGA / FC-FBGA-1152
Speed Grade C3 C4
Temperature Grade Commercial Extended (-40 C to +100 C) —
Core Voltage 1.5 V (Enhanced, 'E' suffix) 1.2 V
High-Speed Transceivers Up to 12 channels (per Stratix II GX family) —
Transceiver Data Rate Up to 6.375 Gbps per channel (family spec) —
DSP Blocks Yes, dedicated 18x18 multipliers and accumulators —
PLL Count [DATA_NEEDED: PLL count for EP2SGX90 variant] —
User I/O Banks 24 (per package datasheet) —
Configuration SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant —
Lead-Free Yes —
Logic Elements (LE) — 90,960
LABs/CLBs — 4,548
Total RAM Bits — 4,520,448 bits
User I/O Count — 558
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Transceivers — Up to 20 channels, 6.375 Gbps per channel
Operating Temperature — Commercial (0C to +85C)
MSL Level — MSL-3 / MS-034AAR-1 (per package outline)
Lead-Free / RoHS — Lead free; RoHS compliance per JEDEC

Datasheets & Resources

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