EP3C16E144C7 vs EP3C16E144C8N Comparison

Detailed side-by-side comparison of EP3C16E144C7 by Intel and EP3C16E144C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16E144C7 EP3C16E144C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Cyclone III Field Programmable Gate Array (FPGA) —
User I/O Count 84 I/O —
Reported Embedded Memory 516096 bit —
Additional Reported Device Data 15408; parameter definition [DATA_NEEDED: definition of the reported 15408 value] —
Package 144-LQFP Exposed Pad 144-LQFP Exposed Pad (EQFP-144)
Number of Terminals 144 terminals —
Package Code LFQFP —
Package Shape Square —
Terminal Form Gull wing —
Mounting Type Surface mount Surface Mount
Logic Elements [DATA_NEEDED: logic element count] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Exposed Pad Dimensions [DATA_NEEDED: exposed pad dimensions] —
Package Dimensions [DATA_NEEDED: package body dimensions] —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Family — Cyclone III
Logic Elements (LEs) — 15,408
Total Memory Bits — 516,096 bits (63 Kbytes)
Embedded Memory Blocks — M9K
Embedded 18x18 Multipliers — 56
User I/O Pins — 84
Phase-Locked Loops (PLLs) — 4
Process Technology — 65 nm
Core Voltage — 1.2 V
Operating Temperature (Commercial) — 0C to +85C
Speed Grade — C8
Configuration Memory — SRAM-based (volatile)

Datasheets & Resources

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