EP3C16F484C7N vs EP3C16F484C6N Comparison

Detailed side-by-side comparison of EP3C16F484C7N by Intel and EP3C16F484C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16F484C7N EP3C16F484C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Family Cyclone III —
Logic Elements 15,408 —
Embedded Memory 504 Kbits (M9K blocks) 516,096 bits (504 Kbits)
Embedded Multipliers 56 (18x18) —
PLLs 4 4
User I/O Pins 346 —
Process Technology 65 nm TSMC low-power 65 nm TSMC
Core Voltage 1.2 V (1.15 V to 1.25 V) —
Package 484-ball FBGA 484-ball FineLine BGA (FBGA)
Speed Grade -7 -6
Operating Temperature 0C to +85C (commercial) —
Maximum Internal Frequency 437.5 MHz —
I/O Standards Supported LVDS, LVCMOS, LVTTL, SSTL, HSTL —
Configuration Method JTAG (IEEE 1149.1), EPCS serial flash, Active Serial —
RoHS Status Compliant Compliant (lead-free, N suffix)
Series — Cyclone III
Family — Cyclone III
Logic Elements (LE) — 15,408
Adaptive Logic Modules (ALMs) — 963 ALMs
Embedded 18x18 Multipliers — 56
User I/O Pins (max) — 346
Global Clock Networks — 20
Core Supply Voltage — 1.15 V to 1.25 V
Operating Temperature (Commercial) — 0 C to 85 C
Ball Pitch — 1.0 mm
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel
Mounting Type — Surface Mount

Datasheets & Resources

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