EP3C16F484C8 vs EP3C16F484C7N Comparison

Detailed side-by-side comparison of EP3C16F484C8 by Intel and EP3C16F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3C16F484C8 EP3C16F484C8 - 516K-Bit Cyclone III FPGA | Intel

EP3C16F484C8 - 516K-Bit Cyclone III FPGA | Intel

EP3C16F484C8 ✓ Active

Specification Comparison

Parameter EP3C16F484C8 EP3C16F484C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Programmable Logic Bits 516,096 bits —
Logic Elements 15,408 logic elements 15,408
I/O Count 346 I/O —
Supply Voltage 1.2 V —
Package 484-pin FBGA 484-ball FBGA
Terminal Count 484 terminals —
Terminal Form Ball —
Package Shape Rectangular —
Mounting Type Surface Mount —
Minimum Operating Temperature [DATA_NEEDED: minimum operating temperature] —
Maximum Operating Temperature [DATA_NEEDED: maximum operating temperature] —
Core Frequency [DATA_NEEDED: maximum core frequency] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
Memory Blocks [DATA_NEEDED: embedded memory block count] —
Block RAM Capacity [DATA_NEEDED: embedded block RAM capacity] —
PLL Count [DATA_NEEDED: PLL count] —
Configuration Method [DATA_NEEDED: configuration methods] JTAG (IEEE 1149.1), EPCS serial flash, Active Serial
RoHS Compliance [DATA_NEEDED: RoHS compliance status] —
REACH Compliance [DATA_NEEDED: REACH compliance status] —
Device Family — Cyclone III
Embedded Memory — 504 Kbits (M9K blocks)
Embedded Multipliers — 56 (18x18)
PLLs — 4
User I/O Pins — 346
Process Technology — 65 nm TSMC low-power
Core Voltage — 1.2 V (1.15 V to 1.25 V)
Speed Grade — -7
Operating Temperature — 0C to +85C (commercial)
Maximum Internal Frequency — 437.5 MHz
I/O Standards Supported — LVDS, LVCMOS, LVTTL, SSTL, HSTL
RoHS Status — Compliant

Datasheets & Resources

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