EP3C16F484C8 vs EP3C16F484C7N Vergleich

Detaillierter Direktvergleich von EP3C16F484C8 von Intel und EP3C16F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16F484C8 EP3C16F484C7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Programmable Logic Bits 516,096 bits —
Logic Elements 15,408 logic elements 15,408
I/O Count 346 I/O —
Versorgungsspannung 1.2 V —
Gehäuse 484-pin FBGA 484-ball FBGA
Terminal Count 484 terminals —
Terminal Form Ball —
Package Shape Rectangular —
Montageart Surface Mount —
Minimum Operating Temperature [DATA_NEEDED: minimum operating temperature] —
Maximum Operating Temperature [DATA_NEEDED: maximum operating temperature] —
Core Frequency [DATA_NEEDED: maximum core frequency] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
Memory Blocks [DATA_NEEDED: embedded memory block count] —
Block RAM Capacity [DATA_NEEDED: embedded block RAM capacity] —
PLL Count [DATA_NEEDED: PLL count] —
Configuration Method [DATA_NEEDED: configuration methods] JTAG (IEEE 1149.1), EPCS serial flash, Active Serial
RoHS Compliance [DATA_NEEDED: RoHS compliance status] —
REACH Compliance [DATA_NEEDED: REACH compliance status] —
Device Family — Cyclone III
Embedded Memory — 504 Kbits (M9K blocks)
Embedded Multipliers — 56 (18x18)
PLLs — 4
User I/O Pins — 346
Process Technology — 65 nm TSMC low-power
Core Voltage — 1.2 V (1.15 V to 1.25 V)
Speed Grade — -7
Betriebstemperatur — 0C to +85C (commercial)
Maximum Internal Frequency — 437.5 MHz
I/O Standards Supported — LVDS, LVCMOS, LVTTL, SSTL, HSTL
RoHS-Status — Compliant

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