EP3C16F484I7 vs EP3C16F484C6N Comparison

Detailed side-by-side comparison of EP3C16F484I7 by Intel and EP3C16F484C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16F484I7 EP3C16F484C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Cyclone III Cyclone III
Manufacturer Intel (formerly Altera) —
Logic Elements 15,408 —
Logic Array Blocks (LABs) 963 —
Total Embedded Memory 516,096 bits (63 KB) —
Embedded Memory Blocks M9K x 56 —
Embedded 18x18 Multipliers 56 56
User I/Os 346 —
General-Purpose PLLs 4 —
Package 484-ball FineLine BGA (F484) 484-ball FineLine BGA (FBGA)
Operating Temperature -40C to +100C (industrial) —
Speed Grade 7 (fastest commercial/industrial) -6
Process Node 60 nm TSMC low-power —
Configuration Method Passive Serial, Fast Passive Parallel, Active Serial, JTAG —
RoHS Status Compliant Compliant (lead-free, N suffix)
Mounting Type Surface Mount Surface Mount
Series — Cyclone III
Logic Elements (LE) — 15,408
Adaptive Logic Modules (ALMs) — 963 ALMs
Embedded Memory — 516,096 bits (504 Kbits)
User I/O Pins (max) — 346
PLLs — 4
Global Clock Networks — 20
Core Supply Voltage — 1.15 V to 1.25 V
Operating Temperature (Commercial) — 0 C to 85 C
Ball Pitch — 1.0 mm
Process Technology — 65 nm TSMC
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel

Datasheets & Resources

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