EP3C16F484I7 vs EP3C16F484C6N Comparación
Comparación detallada lado a lado de EP3C16F484I7 por Intel y EP3C16F484C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16F484I7 | EP3C16F484C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,10 | $338,75 |
| Family | Cyclone III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 15,408 | — |
| Logic Array Blocks (LABs) | 963 | — |
| Total Embedded Memory | 516,096 bits (63 KB) | — |
| Embedded Memory Blocks | M9K x 56 | — |
| Embedded 18x18 Multipliers | 56 | 56 |
| User I/Os | 346 | — |
| General-Purpose PLLs | 4 | — |
| Encapsulado | 484-ball FineLine BGA (F484) | 484-ball FineLine BGA (FBGA) |
| Temperatura de funcionamiento | -40C to +100C (industrial) | — |
| Speed Grade | 7 (fastest commercial/industrial) | -6 |
| Process Node | 60 nm TSMC low-power | — |
| Configuration Method | Passive Serial, Fast Passive Parallel, Active Serial, JTAG | — |
| Estado RoHS | Compliant | Compliant (lead-free, N suffix) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Series | — | Cyclone III |
| Logic Elements (LE) | — | 15,408 |
| Adaptive Logic Modules (ALMs) | — | 963 ALMs |
| Embedded Memory | — | 516,096 bits (504 Kbits) |
| User I/O Pins (max) | — | 346 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Temperature (Commercial) | — | 0 C to 85 C |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 65 nm TSMC |
| Configuration Modes | — | JTAG, Passive Serial, Fast Passive Parallel |