EP3C25F324C8 vs EP3C25F324C8N Comparison

Detailed side-by-side comparison of EP3C25F324C8 by Intel and EP3C25F324C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324C8 EP3C25F324C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Active
Series Cyclone III Cyclone III
Logic Elements 24,624 LE —
Logic Array Blocks 1,539 LABs —
Embedded Memory 608,256 bits —
Embedded Multipliers 66 (18 x 18) —
User I/Os 215 —
PLLs 4 —
Process Technology 65 nm CMOS, SRAM-based —
Core Voltage 1.2 V —
Speed Grade 8 (commercial) 8
Operating Temperature 0 °C to +85 °C (commercial) 0 C to +85 C (commercial, suffix C)
Package 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch 324-BGA (FineLine)
Mounting Type Surface Mount (BGA) Surface Mount
Maximum Internal Clock 402 MHz —
RoHS Status Non-compliant (per Lisleapex listing; original part number without 'N' suffix) Compliant
Family — Cyclone III
Logic Elements (LEs) — 24,624
Total Memory Bits — 608,256 bits
Embedded Memory (Kbits) — 608 Kbits
Number of I/O — 215
Supply Voltage - Core — 1.2 V
Total RAM Bits — 608,256
Process Node — 60 nm low-power CMOS
Number of Multipliers (18x18) — 66
Number of PLLs — 4

Datasheets & Resources

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