EP3C40F484I7 vs EP3C40F484C8 Comparison
Detailed side-by-side comparison of EP3C40F484I7 by Intel and EP3C40F484C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F484I7 | EP3C40F484C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last Time Buy |
| Series | Cyclone III | — |
| Logic Elements | 39,600 LE | — |
| Logic Array Blocks (LABs) | 2,475 LABs | — |
| Embedded Memory | 1,161,216 bits (1136 Kbit) | — |
| User I/O Count | 331 | — |
| Multipliers (DSP) | 126 (18 x 18) | — |
| PLLs | 4 | 4 |
| Process Technology | 65 nm CMOS, low-k | — |
| Core Supply Voltage | 1.2 V | — |
| Package | 484-pin FBGA (FineLine BGA) | 484-ball FBGA (F484), 1.0 mm pitch, 23 x 23 mm |
| Mounting Type | Surface Mount | — |
| Operating Temperature | -40C to +125C (Industrial) | 0C to +85C (commercial) |
| Speed Grade | 7 | C8 (commercial, mid-speed) |
| Lead-Free / RoHS | Yes (Lead Free) | — |
| Maximum Clock Frequency | 472.5 MHz | — |
| Device Family | — | Cyclone III |
| Logic Elements (LE) | — | 39,600 |
| Logic Array Blocks (LAB) | — | 2,475 |
| Embedded Memory (bits) | — | 1,161,216 |
| M9K Memory Blocks | — | 126 |
| Embedded 18x18 Multipliers | — | 56 |
| Maximum User I/O | — | 331 |
| User I/O Banks | — | 8 |
| Process Node | — | 60 nm TSMC low-power CMOS |
| Supply Voltage (Core) | — | 1.2 V |
| Configuration Scheme | — | Active serial (AS), Passive serial (PS), JTAG |
| RoHS Status | — | Compliant (lead-free FBGA) |
| MSL Level | — | 3 (per JEDEC J-STD-020) |