EP3C40F780C6N vs EP3C40F780C8N Comparison
Detailed side-by-side comparison of EP3C40F780C6N by Intel and EP3C40F780C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F780C6N | EP3C40F780C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $172.00 | $64.85 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 | โ |
| Embedded Memory Bits | 1,161,216 | โ |
| Embedded Memory (Kbytes) | 113 | โ |
| M9K Memory Blocks | 126 | โ |
| Logic Array Blocks (LABs) | 4,065 | โ |
| Maximum User I/O Pins | 535 | โ |
| PLLs | 4 | โ |
| Process Technology | 60 nm CMOS | 65nm TSMC low-power |
| Core Voltage | 1.2 V | 1.15V to 1.25V |
| Speed Grade | 6 (commercial) | 8 (C8) |
| Operating Temperature | 0C to +85C (commercial) | 0ยฐC to +85ยฐC (Commercial) |
| Package | 780-ball FBGA (FineLine BGA) | 780-ball FBGA, 1.0mm pitch |
| Package Dimensions | 29 x 29 mm | โ |
| Ball Pitch | 1.0 mm | โ |
| Package Height | 2.6 mm | โ |
| Mounting Type | Surface Mount (FBGA) | Surface Mount (BGA) |
| Lead Free | Yes | โ |
| Configuration Method | SRAM, JTAG via USB-Blaster | โ |
| RoHS Status | Compliant | Compliant |
| Series | โ | Cycloneยฎ III |
| Logic Elements (LE) | โ | 39,600 |
| Total Memory Bits | โ | 1,161,216 bits |
| Number of LABs/CLBs | โ | 2,475 |
| Embedded Memory Blocks | โ | M9K x 126 |
| Embedded 18x18 Multipliers | โ | 126 (up to 396 9x9) |
| Number of PLLs | โ | 4 |
| Maximum User I/Os | โ | 535 |
| Number of I/O Banks | โ | 9 |
| Configuration Modes | โ | AS, PS, FPP, JTAG |