EP3C40F780C6N vs EP3C40F780C8N Comparación
Comparación detallada lado a lado de EP3C40F780C6N por Intel y EP3C40F780C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C40F780C6N | EP3C40F780C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $172,00 | $64,85 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 | — |
| Embedded Memory Bits | 1,161,216 | — |
| Embedded Memory (Kbytes) | 113 | — |
| M9K Memory Blocks | 126 | — |
| Logic Array Blocks (LABs) | 4,065 | — |
| Maximum User I/O Pins | 535 | — |
| PLLs | 4 | — |
| Process Technology | 60 nm CMOS | 65nm TSMC low-power |
| Core Voltage | 1.2 V | 1.15V to 1.25V |
| Speed Grade | 6 (commercial) | 8 (C8) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0°C to +85°C (Commercial) |
| Encapsulado | 780-ball FBGA (FineLine BGA) | 780-ball FBGA, 1.0mm pitch |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Package Height | 2.6 mm | — |
| Tipo de montaje | Surface Mount (FBGA) | Surface Mount (BGA) |
| Lead Free | Yes | — |
| Configuration Method | SRAM, JTAG via USB-Blaster | — |
| Estado RoHS | Compliant | Compliant |
| Series | — | Cyclone® III |
| Logic Elements (LE) | — | 39,600 |
| Total Memory Bits | — | 1,161,216 bits |
| Number of LABs/CLBs | — | 2,475 |
| Embedded Memory Blocks | — | M9K x 126 |
| Embedded 18x18 Multipliers | — | 126 (up to 396 9x9) |
| Number of PLLs | — | 4 |
| Maximum User I/Os | — | 535 |
| Number of I/O Banks | — | 9 |
| Configuration Modes | — | AS, PS, FPP, JTAG |