EP3C55F484C7N vs EP3C55F484C8 Comparison

Detailed side-by-side comparison of EP3C55F484C7N by Intel and EP3C55F484C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C55F484C7N EP3C55F484C8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $52.75 $138.40
Family Cyclone III โ€”
Logic Elements 55,856 โ€”
Embedded Memory (bits) 2,396,160 โ€”
Maximum User I/O 327 โ€”
Number of LABs/CLBs 3,491 โ€”
Embedded Multipliers (18x18) 156 โ€”
PLLs 4 4
Global Clock Networks 20 20
Package 484-FBGA (FineLine BGA) 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height
Speed Grade 7 C8 (commercial, -8)
Operating Temperature 0C to 85C (Commercial) Commercial (0C to +85C)
Process Technology 60 nm TSMC low-power 65 nm low-power CMOS
Configuration Modes JTAG, AS, AP, PS JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS)
Encryption AES-256 โ€”
Supply Voltage 1.2 V core (VCCINT) Core 1.2 V typical, I/O bank dependent
RoHS Status Compliant โ€”
Device Family โ€” Cycloneยฎ III
Logic Elements (LEs) โ€” 55,856
Logic Array Blocks (LABs) โ€” 3,491
Embedded Memory Bits โ€” 2,396,160 bits
Embedded 18x18 Multipliers โ€” 312
User I/Os โ€” 327
Maximum Core Frequency โ€” 472.5 MHz
Lead-Free / RoHS โ€” Yes (Pb-free FBGA)
I/O Standards Supported โ€” LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others

Datasheets & Resources

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