EP3C5E144C7N vs EP3C5E144I7N Comparison

Detailed side-by-side comparison of EP3C5E144C7N by Intel and EP3C5E144I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C5E144C7N EP3C5E144I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Family Cyclone III —
Logic Elements (LE) 5,136 5,136
Logic Array Blocks (LAB) 290 —
Total Memory Bits 423,936 —
Embedded M9K Memory Blocks 46 —
Embedded 18x18 Multipliers 46 23
PLLs 4 4
User I/Os 94 —
Speed Grade C7 (7 ns delay) —
Process Technology TSMC 65 nm low-power 60 nm low-k
Package 144-LQFP Exposed Pad (EQFP-144), 22x22 mm, 0.5 mm pitch 144-pin EQFP (Enhanced QFP) with exposed pad
Operating Junction Temperature 0C to +85C —
Configuration Modes AS, PS, FPP, JTAG —
I/O Standards LVDS, SSTL, HSTL, LVCMOS, PCI/PCI-X —
RoHS Status Compliant Compliant
Family — Cyclone III
Embedded Memory Bits — 423,936
Maximum User I/O Pins — 94
Core Voltage — 1.2 V
Maximum Internal Clock Frequency — 437.5 MHz
Package Dimensions — 20 mm x 20 mm, 0.4 mm pitch
Operating Temperature — -40 °C to +100 °C (industrial)
Configuration Interface — JTAG (IEEE 1149.1), passive serial, active serial
Mounting Type — Surface Mount
MSL Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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