EP3C5F256C6N vs EP3C5F256C8N Comparison
Detailed side-by-side comparison of EP3C5F256C6N by Intel and EP3C5F256C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5F256C6N | EP3C5F256C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone III | — |
| Series | EP3C5 | Cyclone III |
| Logic Elements (LEs) | 5136 | 5,136 |
| Logic Array Blocks (LABs) | 182 (per DigiKey listing) | — |
| Total Memory Bits | 423936 | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | 182 |
| Core Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Operating Temperature | 0 C to +85 C (commercial "C6" speed grade) | 0C to 85C (Commercial) |
| Package | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch | 256-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS / Lead-Free | Lead-free (per distributor listings) | — |
| Configuration Modes | Serial, Parallel, JTAG, AS, PS | — |
| Device Family | — | Cyclone III (EP3C5) |
| Embedded Memory (bits) | — | 423,936 |
| Embedded Memory (Kbits) | — | 414 Kbits |
| Process Technology | — | 65 nm |
| Configuration Memory | — | SRAM-based (in-system reprogrammable) |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| RoHS Status | — | Lead Free (per Altera/Intel product page) |