EP3C5F256C6N vs EP3C5F256C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256C6N disebabkan oleh Intel dan EP3C5F256C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5F256C6N | EP3C5F256C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | — |
| Series | EP3C5 | Cyclone III |
| Logic Elements (LEs) | 5136 | 5,136 |
| Logic Array Blocks (LABs) | 182 (per DigiKey listing) | — |
| Total Memory Bits | 423936 | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | 182 |
| Core Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Suhu Operasi | 0 C to +85 C (commercial "C6" speed grade) | 0C to 85C (Commercial) |
| Kemasan | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch | 256-ball FBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| RoHS / Lead-Free | Lead-free (per distributor listings) | — |
| Configuration Modes | Serial, Parallel, JTAG, AS, PS | — |
| Device Family | — | Cyclone III (EP3C5) |
| Embedded Memory (bits) | — | 423,936 |
| Embedded Memory (Kbits) | — | 414 Kbits |
| Process Technology | — | 65 nm |
| Configuration Memory | — | SRAM-based (in-system reprogrammable) |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Status RoHS | — | Lead Free (per Altera/Intel product page) |