EP3C5F256I7 vs EP3C5F256C8N Comparison
Detailed side-by-side comparison of EP3C5F256I7 by Intel and EP3C5F256C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5F256I7 | EP3C5F256C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| FPGA Family | Cyclone III | — |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements | 5136 | — |
| Total RAM Bits | 423936 bits | — |
| Maximum User I/O Count | 182 | — |
| Package / Case | 256-LBGA (FBGA-256) | — |
| Package Shape | Square | — |
| Number of Terminals | 256 | — |
| Terminal Form | Ball | — |
| Mounting Type | Surface Mount | Surface Mount |
| Technology | CMOS | — |
| Maximum Operating Frequency | 472.5 MHz | — |
| Operating Temperature Range | -40C to 125C | — |
| Speed Grade | 7 (per -7 order code) | — |
| Temperature Grade | I (industrial, per -I7 order code) | — |
| Lead-Free Finish | Yes (per distributor listing) | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Series | — | Cyclone III |
| Device Family | — | Cyclone III (EP3C5) |
| Logic Elements (LEs) | — | 5,136 |
| Embedded Memory (bits) | — | 423,936 |
| Embedded Memory (Kbits) | — | 414 Kbits |
| Embedded 18x18 Multipliers | — | 23 |
| PLLs | — | 4 |
| Maximum User I/Os | — | 182 |
| Core Voltage | — | 1.15 V to 1.25 V |
| Operating Temperature | — | 0C to 85C (Commercial) |
| Package | — | 256-ball FBGA (FineLine BGA) |
| Process Technology | — | 65 nm |
| Configuration Memory | — | SRAM-based (in-system reprogrammable) |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| RoHS Status | — | Lead Free (per Altera/Intel product page) |