EP3CLS100F780C8 vs EP3C55F780C8 Comparison

Detailed side-by-side comparison of EP3CLS100F780C8 by Intel and EP3C55F780C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS100F780C8 EP3C55F780C8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Cyclone III LS Cyclone III
Logic Elements (LE) 100,448 —
Logic Array Blocks (LAB) [DATA_NEEDED: LAB count] —
Total Embedded Memory 4,451,328 bits —
Embedded Memory Blocks (M9K) 483 —
Embedded 18x18 Multipliers 483 —
Maximum User I/O 413 —
PLLs 4 4
Global Clock Networks 20 20
Core Voltage 1.2 V 1.2 V
Process Technology 60 nm low-power TSMC 65 nm
Package 780-ball FBGA (F780) 780-ball FBGA
Device Type FPGA - Field Programmable Gate Array —
Bitstream Encryption AES-256 (Cyclone III LS feature) —
Operating Temperature Grade Commercial (C8 speed grade) —
Speed Grade 8 (slowest commercial) 8
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant Compliant
Configuration Controller Cyclone III LS (AES-enabled) —
Logic Elements — 55,856
Embedded Memory — 2,396,160 bits (234 M9K blocks)
Embedded Multipliers (18x18) — 156
User I/O Pins — 377
Operating Temperature — 0C to +85C (Commercial)
Configuration Memory — SRAM-based

Datasheets & Resources

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