EP3CLS70F484C8 vs EP3CLS100F484C8N Comparison

Detailed side-by-side comparison of EP3CLS70F484C8 by Intel and EP3CLS100F484C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS70F484C8 EP3CLS100F484C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $198.00 $115.40
Family Cyclone III LS โ€”
Logic Elements 70,208 100,448
Logic Array Blocks (LABs) 278 โ€”
Total Embedded Memory Bits 3,068,928 โ€”
Embedded Memory Blocks M9K (4 Kbit each) โ€”
Embedded Multipliers (18x18) 300 4,488 (per Cyclone III LS family handbook, 100K LE tier)
Maximum User I/O Pins 278 โ€”
PLLs 4 4 (per Cyclone III LS family)
Global Clock Networks 20 โ€”
Process Technology 65 nm TSMC low-power TSMC 65 nm low-power (LP)
Core Supply Voltage 1.2 V โ€”
Operating Junction Temperature 0C to +85C (commercial) โ€”
Package 484-ball FineLine BGA (FBGA-484) โ€”
Bitstream Encryption AES-256 (Cyclone III LS feature) AES-128 (Cyclone III LS security feature)
Configuration Mode Active serial, passive serial, JTAG, fast passive parallel โ€”
RoHS Status Compliant Compliant (Pb-free, 'N' suffix)
Lead-Free Yes โ€”
Series โ€” Cycloneยฎ III LS
Family Name โ€” Cyclone III LS
Embedded Memory Bits โ€” 4,451,328 bits
Number of I/O โ€” 278 (maximum user I/O)
Number of Logic Blocks / Cells โ€” 47 (logic blocks reported by DigChip snapshot)
Package Type โ€” FBGA-484 (FineLine BGA, lead-free)
Pin / Ball Count โ€” 484
Supply Voltage (Core) โ€” 1.2 V
Speed Grade โ€” C8 (commercial, fastest)
Operating Temperature โ€” 0ยฐC to +85ยฐC (commercial grade)
Mounting Type โ€” Surface Mount
Configuration Interface โ€” JTAG, Passive Serial, Active Serial
MSL Level โ€” 3 (per JEDEC J-STD-020, typical for BGA)
DSP Blocks โ€” Integrated (multiplier-based)

Datasheets & Resources

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