EP3CLS70F484C8 vs EP3CLS100F484C8N Vergleich

Detaillierter Direktvergleich von EP3CLS70F484C8 von Intel und EP3CLS100F484C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS70F484C8 EP3CLS100F484C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $198,00 $115,40
Family Cyclone III LS —
Logic Elements 70,208 100,448
Logic Array Blocks (LABs) 278 —
Total Embedded Memory Bits 3,068,928 —
Embedded Memory Blocks M9K (4 Kbit each) —
Embedded Multipliers (18x18) 300 4,488 (per Cyclone III LS family handbook, 100K LE tier)
Maximum User I/O Pins 278 —
PLLs 4 4 (per Cyclone III LS family)
Global Clock Networks 20 —
Process Technology 65 nm TSMC low-power TSMC 65 nm low-power (LP)
Core Supply Voltage 1.2 V —
Betriebs-Sperrschichttemperatur 0C to +85C (commercial) —
Gehäuse 484-ball FineLine BGA (FBGA-484) —
Bitstream Encryption AES-256 (Cyclone III LS feature) AES-128 (Cyclone III LS security feature)
Configuration Mode Active serial, passive serial, JTAG, fast passive parallel —
RoHS-Status Compliant Compliant (Pb-free, 'N' suffix)
Lead-Free Yes —
Series — Cyclone® III LS
Family Name — Cyclone III LS
Embedded Memory Bits — 4,451,328 bits
Number of I/O — 278 (maximum user I/O)
Number of Logic Blocks / Cells — 47 (logic blocks reported by DigChip snapshot)
Package Type — FBGA-484 (FineLine BGA, lead-free)
Pin / Ball Count — 484
Supply Voltage (Core) — 1.2 V
Speed Grade — C8 (commercial, fastest)
Betriebstemperatur — 0°C to +85°C (commercial grade)
Montageart — Surface Mount
Configuration Interface — JTAG, Passive Serial, Active Serial
MSL-Level — 3 (per JEDEC J-STD-020, typical for BGA)
DSP Blocks — Integrated (multiplier-based)

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