EP3CLS70F484I7N vs EP3CLS70F484C7N Comparison

Detailed side-by-side comparison of EP3CLS70F484I7N by Intel and EP3CLS70F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS70F484I7N EP3CLS70F484C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Active
Family Cyclone III LS —
Logic Elements (LEs) 70,208 —
Embedded Memory Bits 3,068,928 bits 3,068,928
User I/Os 278 —
DSP Blocks (18x18 Multipliers) 274 —
PLLs 4 —
Maximum User I/O Pins 294 —
Process Technology 65 nm low-power CMOS TSMC 65nm low-power (LP)
Core Supply Voltage 1.2 V —
Package 484-ball FBGA (FineLine BGA), 1.0 mm pitch —
Operating Temperature -40C to +100C (Industrial, I7 speed grade) [DATA_NEEDED: commercial/industrial grade]
Configuration Mode Passive Serial, Active Serial, JTAG —
Memory Interfaces DDR2, DDR3, QDRII+, RLDRAM II —
LVDS Data Rate Up to 875 Mbps per channel —
RoHS Status Compliant Compliant (per Intel product page)
Device Family — Cyclone® III LS
Logic Elements (LE) — 70,208
Logic Array Blocks (LABs) — 4,388
Maximum User I/Os — 278
Maximum Operating Frequency — 437.5 MHz
Core Supply Voltage (VCCINT) — 1.2 V
Package Type — 484-ball FineLine BGA (FBGA-484)
Package Dimensions — 19 x 19 mm, 1.0 mm ball pitch
Mounting Type — Surface Mount
MSL Level — [DATA_NEEDED: MSL rating]
Configuration Method — JTAG / Passive Serial / Active Serial
Design Tool — Intel Quartus II (Cyclone III support)

Datasheets & Resources

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