EP3CLS70F484I7N vs EP3CLS70F484C7N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS70F484I7N disebabkan oleh Intel dan EP3CLS70F484C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3CLS70F484I7N EP3CLS70F484I7N - Cyclone III LS FPGA, 70K LEs, 484-FBGA | Intel

EP3CLS70F484I7N - Cyclone III LS FPGA, 70K LEs, 484-FBGA | Intel

EP3CLS70F484I7N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3CLS70F484I7N EP3CLS70F484C7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Aktif
Family Cyclone III LS —
Logic Elements (LEs) 70,208 —
Embedded Memory Bits 3,068,928 bits 3,068,928
User I/Os 278 —
DSP Blocks (18x18 Multipliers) 274 —
PLLs 4 —
Maximum User I/O Pins 294 —
Process Technology 65 nm low-power CMOS TSMC 65nm low-power (LP)
Core Supply Voltage 1.2 V —
Kemasan 484-ball FBGA (FineLine BGA), 1.0 mm pitch —
Suhu Operasi -40C to +100C (Industrial, I7 speed grade) [DATA_NEEDED: commercial/industrial grade]
Configuration Mode Passive Serial, Active Serial, JTAG —
Memory Interfaces DDR2, DDR3, QDRII+, RLDRAM II —
LVDS Data Rate Up to 875 Mbps per channel —
Status RoHS Compliant Compliant (per Intel product page)
Device Family — Cyclone® III LS
Logic Elements (LE) — 70,208
Logic Array Blocks (LABs) — 4,388
Maximum User I/Os — 278
Maximum Operating Frequency — 437.5 MHz
Core Supply Voltage (VCCINT) — 1.2 V
Package Type — 484-ball FineLine BGA (FBGA-484)
Package Dimensions — 19 x 19 mm, 1.0 mm ball pitch
Jenis Pemasangan — Surface Mount
Aras MSL — [DATA_NEEDED: MSL rating]
Configuration Method — JTAG / Passive Serial / Active Serial
Design Tool — Intel Quartus II (Cyclone III support)

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga