EP3CLS70F780C8 vs EP3CLS70F780C8N Comparison

Detailed side-by-side comparison of EP3CLS70F780C8 by Intel and EP3CLS70F780C8N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS70F780C8 EP3CLS70F780C8N
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $56.75 $0.00
Family Cyclone III LS Cyclone III LS
Logic Elements (LE) 70,208 β€”
Logic Array Blocks (LAB) 4,463 β€”
Embedded Memory Bits 3,068,928 bit β€”
Embedded Memory (M9K blocks) 305 β€”
Embedded 18x18 Multipliers 244 β€”
Maximum User I/O Pins 413 β€”
Maximum Operating Frequency 402 MHz 402 MHz
Process Technology 65 nm TSMC low-power CMOS 65 nm
Core Supply Voltage 1.2 V β€”
Package 780-ball FineLine BGA (FBGA-780) β€”
Operating Junction Temperature 0 Β°C to +85 Β°C (commercial) β€”
PLLs 4 general-purpose PLLs β€”
Global Clock Networks 20 β€”
Security Features AES bitstream encryption, JTAG tamper protection β€”
Configuration Scheme Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP) β€”
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Mounting Type Surface Mount (BGA) Surface Mount
Device Type β€” Field Programmable Gate Array (FPGA)
Logic Cells / Logic Blocks β€” 47
Logic Cell Count β€” 70,208 cells
User I/O β€” 413 I/O
Supply Voltage β€” 1.2 V
Package Type β€” FBGA
Package Pin Count β€” 780 balls
Package Form β€” BGA, square
Temperature Grading β€” Other
Configuration Type β€” SRAM-based FPGA
REACH Status β€” [DATA_NEEDED: REACH status]
AEC-Q100 Qualification β€” [DATA_NEEDED: AEC-Q100 qualification]

Datasheets & Resources

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