EP3CLS70F780C8 vs EP3CLS70F780C8N Perbandingan
Perbandingan bersamaan detil EP3CLS70F780C8 dari Intel dan EP3CLS70F780C8N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3CLS70F780C8 | EP3CLS70F780C8N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 70,208 | — |
| Logic Array Blocks (LAB) | 4,463 | — |
| Embedded Memory Bits | 3,068,928 bit | — |
| Embedded Memory (M9K blocks) | 305 | — |
| Embedded 18x18 Multipliers | 244 | — |
| Maximum User I/O Pins | 413 | — |
| Maximum Operating Frequency | 402 MHz | 402 MHz |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm |
| Core Supply Voltage | 1.2 V | — |
| Paket | 780-ball FineLine BGA (FBGA-780) | — |
| Suhu Hubung Kerja | 0 °C to +85 °C (commercial) | — |
| PLLs | 4 general-purpose PLLs | — |
| Global Clock Networks | 20 | — |
| Security Features | AES bitstream encryption, JTAG tamper protection | — |
| Configuration Scheme | Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells / Logic Blocks | — | 47 |
| Logic Cell Count | — | 70,208 cells |
| User I/O | — | 413 I/O |
| Tegangan Pemuat | — | 1.2 V |
| Package Type | — | FBGA |
| Package Pin Count | — | 780 balls |
| Package Form | — | BGA, square |
| Temperature Grading | — | Other |
| Configuration Type | — | SRAM-based FPGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |