EP3SE260F1517I3G vs EP3SE260F1517C4N Comparison
Detailed side-by-side comparison of EP3SE260F1517I3G by Intel and EP3SE260F1517C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1517I3G | EP3SE260F1517C4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | NRND |
| Family | Stratix III E | Field-Programmable Gate Array (FPGA) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Core Voltage | 1.1 V | 0.9 V |
| User I/O Count | 976 | — |
| Package | 1517-ball FC-FBGA (Flip-Chip BGA) | 1517-BBGA, FCBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Process Node | 65 nm | 65 nm |
| Embedded Multipliers | 768 (18x18) | — |
| PLL Count | 12 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Lead-Free / RoHS | Yes (RoHS compliant per DigiKey listing) | — |
| MSL Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Series | — | Stratix® III E |
| Embedded Memory | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| Maximum User I/Os | — | 976 |
| Operating Temperature | — | 0°C to 85°C |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |
| Maximum Transceiver Data Rate | — | 12.5 Gbps |