EP3SE50F780I3 vs EP3SE50F780C4LN Comparison

Detailed side-by-side comparison of EP3SE50F780I3 by Intel and EP3SE50F780C4LN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F780I3 EP3SE50F780C4LN
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Active
Family Stratix III Enhanced (E) Stratix III E
Logic Elements 47,500 47,500
Logic Array Blocks (LABs) 1,900 —
Embedded Memory (bits) 5,760,000 —
User I/O Count 488 —
Internal Frequency (max) 800 MHz —
Operating Temperature Range -40 C to +100 C (industrial, 'I' grade) —
Supply Voltage (Core) 0.86 V to 1.13 V (typical 1.1 V) —
Process Technology 65 nm —
Package 780-ball FC-FBGA (FineLine BGA) 780-ball FC-FBGA
Configuration Mode Passive Serial / Fast Passive Parallel / JTAG —
PLLs Up to 8 (fractional-N) —
DSP Multiplier Blocks Yes (per-ALM DSP blocks) —
Adaptive Logic Modules (ALMs) Yes —
RoHS Status Compliant Compliant
MSL Level 3 (168 hours) —
Lead-Free Yes —
LABs (Logic Array Blocks) — 1,900
Embedded Memory — 5,760,000 bits
User I/Os — 488
Process Node — 65 nm
Core Voltage — 0.9 V
Speed Grade — C4
Operating Temperature — 0°C to 85°C (Commercial)
Mounting Type — Surface Mount (BGA)
Lead-Free / RoHS — Yes (L suffix)
Maximum Toggle Frequency — 375 MHz
Configuration Modes — Passive Serial, Fast Passive, Active Serial (AS), Active Parallel (AP), JTAG
DSP Blocks — Yes (embedded multipliers)
Block RAM Type — M9K + M144K
Memory Architecture — SRAM-based, reprogrammable

Datasheets & Resources

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