EP3SE50F780I4L vs EP3SE110F780I4L Comparison

Detailed side-by-side comparison of EP3SE50F780I4L by Intel and EP3SE110F780I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F780I4L EP3SE110F780I4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy NRND
Family Stratix III Enhanced (E) Stratix III E
Logic Elements (LEs) 47,500 —
Logic Array Blocks (LABs) 1,900 —
User I/Os 488 488
Total Embedded Memory 5,760 Kbits —
Number of Pins 780 —
Package 780-BBGA, FCBGA 780-pin FC-FBGA (Flip-Chip BGA)
Process Technology 65 nm 65 nm CMOS
Core Voltage 0.9 V (1.05 V to 1.15 V option) 0.9 V
Operating Frequency (max) 375 MHz —
Speed Grade I4 —
Operating Temperature -40C to +100C (Industrial) —
Mounting Type Surface Mount (BGA) Surface Mount (FC-FBGA)
MSL Level 3 (168 hours) —
RoHS Status Compliant Compliant (per legacy Altera data)
Logic Elements — 107,500
LABs (Logic Array Blocks) — 4,300
Embedded Memory — 8,936,448 bits (8.9 Mbit)
Maximum Operating Frequency — 375 MHz
Package Body Size — 29 mm × 29 mm
Ball Pitch — 1.0 mm
Operating Temperature (Industrial) — -40 °C to +100 °C
Product Status — Not Recommended for New Designs (NRND)

Datasheets & Resources

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