EP3SE50F780I4L vs EP3SE110F780I4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780I4L sa pamamagitan ng Intel at EP3SE110F780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE50F780I4L - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
EP3SE50F780I4L ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP3SE50F780I4L | EP3SE110F780I4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III Enhanced (E) | Stratix III E |
| Logic Elements (LEs) | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| User I/Os | 488 | 488 |
| Total Embedded Memory | 5,760 Kbits | — |
| Bilang ng Pins | 780 | — |
| Packhaging | 780-BBGA, FCBGA | 780-pin FC-FBGA (Flip-Chip BGA) |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 0.9 V (1.05 V to 1.15 V option) | 0.9 V |
| Operating Frequency (max) | 375 MHz | — |
| Speed Grade | I4 | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (FC-FBGA) |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | Compliant (per legacy Altera data) |
| Logic Elements | — | 107,500 |
| LABs (Logic Array Blocks) | — | 4,300 |
| Embedded Memory | — | 8,936,448 bits (8.9 Mbit) |
| Maximum Operating Frequency | — | 375 MHz |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |