EP3SE50F780I4L vs EP3SE50F780I4LG Comparison

Detailed side-by-side comparison of EP3SE50F780I4L by Intel and EP3SE50F780I4LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F780I4L EP3SE50F780I4LG
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy NRND
Family Stratix III Enhanced (E) Stratix III
Logic Elements (LEs) 47,500 —
Logic Array Blocks (LABs) 1,900 —
User I/Os 488 —
Total Embedded Memory 5,760 Kbits —
Number of Pins 780 —
Package 780-BBGA, FCBGA 780-ball FCBGA (FBGA-780)
Process Technology 65 nm —
Core Voltage 0.9 V (1.05 V to 1.15 V option) —
Operating Frequency (max) 375 MHz —
Speed Grade I4 —
Operating Temperature -40C to +100C (Industrial) —
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level 3 (168 hours) —
RoHS Status Compliant —
Series — Stratix III E
Logic Elements — 47,500
Adaptive Logic Modules (ALMs) — 19,000
Embedded Memory — 5.49 Mbit
Maximum User I/Os — 488
Operating Supply Voltage (Core) — 1.1 V
Operating Temperature Range — -40 C to +100 C
Process Node — 65 nm
DSP Blocks — Yes (dedicated, count not in source data)
High-Speed Transceivers — Multi-gigabit, count not in source data
Lead-Free / RoHS — Yes (G suffix = Pb-free)
Packaging — Tray
Memory Type — Embedded SRAM block RAM

Datasheets & Resources

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