EP3SE80F1152C3N vs EP3SE80F1152C4 Comparison
Detailed side-by-side comparison of EP3SE80F1152C3N by Intel and EP3SE80F1152C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE80F1152C3N | EP3SE80F1152C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Active |
| Series | Stratix III E | Stratix III E |
| Logic Elements (LEs) | 80,000 | — |
| Total Memory Bits | 6,843,392 bits | — |
| Number of LABs/CLBs | 3200 | — |
| Number of User I/O | 744 | — |
| Number of Outputs | 744 | — |
| Package / Case | 1152-BBGA, FCBGA (FineLine BGA) | — |
| Operating Temperature | 0C to +85C (commercial, C3 grade) | 0C to +85C (Commercial) |
| Speed/Power Grade | C3 | — |
| Process Technology | 40 nm CMOS | 65 nm CMOS |
| Mounting Type | Surface Mount | Surface Mount |
| Lead Free | Yes | — |
| MSL Level | 3 (per JEDEC J-STD-020) | — |
| Configuration Memory | SRAM-based, volatile (needs external config device) | — |
| RoHS Status | Compliant | Compliant |
| Family | — | Stratix III Enhanced |
| Device Type | — | FPGA |
| Logic Elements | — | 80,000 |
| Logic Array Blocks (LABs) | — | 3200 |
| Total RAM Bits | — | 6,843,392 |
| User I/Os | — | 744 |
| Core Voltage | — | 1.1 V |
| Internal Frequency (max) | — | 800 MHz |
| Package | — | 1152-ball FC-FBGA (Fine-pitch Chip-scale BGA) |
| Configuration Method | — | SRAM-based, JTAG / EPCS serial |
| DSP Blocks | — | Yes (variable-precision, 18x18 multipliers) |