EP3SL70F484I3 vs EP3SL70F484I4LG Comparison
Detailed side-by-side comparison of EP3SL70F484I3 by Intel and EP3SL70F484I4LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL70F484I3 | EP3SL70F484I4LG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,013.66 | $598.00 |
| Family | Stratix III L | Stratix III (low-static-power variant) |
| Logic Elements | 67,500 | β |
| Adaptive Logic Modules (ALMs) | 33,000 | β |
| Logic Array Blocks (LABs) | 2,700 | β |
| Total Embedded Memory | 2,699,264 bits (337 KB) | β |
| M9K Memory Blocks | 288 | β |
| M144K Memory Blocks | 12 | β |
| DSP Blocks (18x18 multipliers) | 384 | β |
| User I/O Pins | 296 | β |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | β |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | β |
| Process Node | TSMC 40 nm | 40 nm |
| Speed Grade | -3 (mid-tier) | I4 (industrial, -4 speed bin) |
| Operating Temperature | -40C to +100C (industrial) | -40 C to +100 C (Industrial) |
| Package | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | 484-BBGA, FCBGA |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | β |
| Design Software | Quartus II (legacy) | β |
| RoHS Status | Compliant | Compliant (lead-free FCBGA) |
| Series | β | Stratix III L |
| Logic Elements (LE) | β | 67,500 |
| Adaptive Logic Modules (ALM) | β | 27,000 |
| Embedded Memory (Bits) | β | 2,699,264 |
| Embedded Block RAM | β | 2.57 Mbit |
| Number of User I/Os | β | 296 |
| Operating Supply Voltage (Core) | β | 1.1 V |
| Mounting Style | β | SMD/SMT |
| Programming Toolchain | β | Quartus II / Quartus Prime (Intel FPGA) |