EP3SL70F484I3 vs EP3SL70F484I4LG Comparaison
Comparaison détaillée côte à côte de EP3SL70F484I3 par Intel et EP3SL70F484I4LG par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SL70F484I3 | EP3SL70F484I4LG |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 013,66 | $598,00 |
| Family | Stratix III L | Stratix III (low-static-power variant) |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,000 | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Total Embedded Memory | 2,699,264 bits (337 KB) | — |
| M9K Memory Blocks | 288 | — |
| M144K Memory Blocks | 12 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/O Pins | 296 | — |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | — |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | — |
| Process Node | TSMC 40 nm | 40 nm |
| Speed Grade | -3 (mid-tier) | I4 (industrial, -4 speed bin) |
| Température de fonctionnement | -40C to +100C (industrial) | -40 C to +100 C (Industrial) |
| Boîtier | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | 484-BBGA, FCBGA |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | — |
| Design Software | Quartus II (legacy) | — |
| Statut RoHS | Compliant | Compliant (lead-free FCBGA) |
| Series | — | Stratix III L |
| Logic Elements (LE) | — | 67,500 |
| Adaptive Logic Modules (ALM) | — | 27,000 |
| Embedded Memory (Bits) | — | 2,699,264 |
| Embedded Block RAM | — | 2.57 Mbit |
| Number of User I/Os | — | 296 |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Style de montage | — | SMD/SMT |
| Programming Toolchain | — | Quartus II / Quartus Prime (Intel FPGA) |