EP3SL70F484I4LG vs EP3SL70F484C4N Comparison

Detailed side-by-side comparison of EP3SL70F484I4LG by Intel and EP3SL70F484C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SL70F484C4N EP3SL70F484C4N - Stratix III L FPGA 67.5K LE FBGA-484 | Intel

EP3SL70F484C4N - Stratix III L FPGA 67.5K LE FBGA-484 | Intel

EP3SL70F484C4N ⚠ Last Time Buy

Specification Comparison

Parameter EP3SL70F484I4LG EP3SL70F484C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $598.00 $580.00
Series Stratix III L —
Family Stratix III (low-static-power variant) Stratix III L
Process Node 40 nm —
Logic Elements (LE) 67,500 —
Adaptive Logic Modules (ALM) 27,000 —
Embedded Memory (Bits) 2,699,264 —
Embedded Block RAM 2.57 Mbit —
Number of User I/Os 296 —
Package 484-BBGA, FCBGA —
Operating Supply Voltage (Core) 1.1 V —
Operating Temperature -40 C to +100 C (Industrial) 0C to +85C (Commercial, TJ)
Mounting Style SMD/SMT —
Speed Grade I4 (industrial, -4 speed bin) -C4
RoHS Status Compliant (lead-free FCBGA) Compliant
Programming Toolchain Quartus II / Quartus Prime (Intel FPGA) —
Logic Elements — 67,500
Adaptive Logic Modules (ALMs) — 33,880
LABs/CLBs — 2,700
Number of Logic Cells / Gates — 67,500
Embedded Memory (Block RAM) — 2,699,264 bits (2.7 Mbit)
Number of I/Os — 296
Number of Transceivers — [DATA_NEEDED: number of embedded transceivers]
Core Voltage — 1.1 V
Process Technology — 65 nm
Package Type — 484-ball FCBGA (FineLine BGA)
Package Code — F484
Ball Pitch — 1.0 mm
Mounting Type — Surface Mount
Configuration Mode — JTAG, Passive Serial, Fast Passive Parallel, Host Bus
MSL Level — 3

Datasheets & Resources

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