EP4CE55F23A7N vs EP4CE55F23I7N Comparison
Detailed side-by-side comparison of EP4CE55F23A7N by Intel and EP4CE55F23I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE55F23A7N | EP4CE55F23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV E | — |
| Series | EP4CE55 | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Logic Array Blocks (LAB) | 2,436 | — |
| Embedded Memory Bits | 2,396,160 | — |
| Embedded Memory Blocks | 234 (M9K) | — |
| Embedded Multipliers (18x18) | 154 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | — |
| Maximum User I/O Pins | 324 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog PLL Supply (VCCA) | 2.5 V | — |
| Process Technology | 60 nm low-power | TSMC 60 nm low-power |
| Speed Grade | -7 | — |
| Package | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (23x23 mm, 1.0 mm pitch) |
| Operating Temperature (Junction) | -40C to +125C | — |
| Configuration Modes | JTAG, AS, AP, PS | JTAG, AS, PS, FPP |
| AEC-Q100 | Qualified (automotive grade) | — |
| Logic Elements | — | 55,856 |
| Configurable Logic Blocks (CLBs) | — | 3,491 |
| Embedded Memory | — | 2,396,160 bits |
| Embedded 18x18 Multipliers | — | 56 |
| Maximum User I/O | — | 324 |
| Core Voltage | — | 1.2 V |
| Operating Temperature | — | -40C to +100C (industrial, I7 grade) |
| Mounting Type | — | Surface Mount (BGA) |
| Lead-Free / RoHS | — | Yes (lead-free finish) |
| Memory Interface Support | — | DDR, DDR2, QDRII |