EP4CE55F23I7N vs EP4CE75F23I7 Comparison

Detailed side-by-side comparison of EP4CE55F23I7N by Intel and EP4CE75F23I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CE55F23I7N EP4CE75F23I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Series Cyclone IV E —
Logic Elements 55,856 —
Configurable Logic Blocks (CLBs) 3,491 —
Embedded Memory 2,396,160 bits —
Embedded 18x18 Multipliers 56 274
PLLs 4 —
Maximum User I/O 324 426
Package 484-ball FBGA (23x23 mm, 1.0 mm pitch) 484-ball FineLine BGA (F23)
Process Technology TSMC 60 nm low-power 60 nm low-power
Core Voltage 1.2 V —
Operating Temperature -40C to +100C (industrial, I7 grade) -40C to +85C (industrial)
Mounting Type Surface Mount (BGA) —
Lead-Free / RoHS Yes (lead-free finish) —
Configuration Modes JTAG, AS, PS, FPP AS, PS, FPP, JTAG
Memory Interface Support DDR, DDR2, QDRII —
Family — Cyclone IV E
Logic Elements (LE) — 75,408
Embedded Memory (bits) — 2,810,880
General Purpose PLLs — 4
Global Clock Networks — 20
Core Voltage (VCCINT) — 1.2 V
I/O Voltage (VCCIO) — 1.2 V to 3.3 V
Bitstream Encryption — AES-128
RoHS Status — Compliant
Speed Grade — I7
MSL Level — 3

Datasheets & Resources

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