EP4CE6E22I7 vs EP4CE6E22I7N Comparison
Detailed side-by-side comparison of EP4CE6E22I7 by Intel and EP4CE6E22I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE6E22I7 | EP4CE6E22I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 6,272 | — |
| Embedded Memory | 270 Kbits (M9K blocks) | — |
| Embedded Multipliers (18 x 18) | 15 | — |
| PLLs | 2 | — |
| Global Clock Networks | 8 | Up to 20 |
| Maximum User I/O Pins | 91 | — |
| Process Technology | 60 nm (low-power) | 60 nm (TSMC low-power) |
| Core Voltage | 1.2 V | — |
| Operating Temperature (Industrial) | -40C to +100C | — |
| Package | 144-pin EQFP with exposed pad (22 x 22 mm) | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad |
| Mounting Type | Surface Mount | Surface Mount |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| On-Chip Termination | Dynamic OCT supported | — |
| Configuration Methods | Active Serial, Passive Serial, JTAG, Fast Passive Parallel | — |
| MSL Level | 3 (168 hours) | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant | Compliant |
| Logic Elements (LEs) | — | 6,272 |
| Configurable Logic Blocks (CLBs) | — | 392 |
| Embedded Memory (RAM) | — | 270 Kbits |
| User Flash Memory | — | 4 Kbits |
| User I/O Pins | — | 91 |
| PLLs (General-Purpose) | — | 2 |
| Core Voltage (VCCINT) | — | 1.0 V to 1.2 V (nominal 1.2 V) |
| Operating Temperature (I7 grade) | — | -40C to +100C (junction) |
| Maximum Operating Frequency | — | Up to 472.5 MHz |
| Configuration Method | — | Serial (EPCS) or JTAG |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |