EP4CE6E22I7 vs EP4CE6E22I7N Comparación
Comparación detallada lado a lado de EP4CE6E22I7 por Intel y EP4CE6E22I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6E22I7 | EP4CE6E22I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,50 | $11,85 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 6,272 | — |
| Embedded Memory | 270 Kbits (M9K blocks) | — |
| Embedded Multipliers (18 x 18) | 15 | — |
| PLLs | 2 | — |
| Global Clock Networks | 8 | Up to 20 |
| Maximum User I/O Pins | 91 | — |
| Process Technology | 60 nm (low-power) | 60 nm (TSMC low-power) |
| Core Voltage | 1.2 V | — |
| Operating Temperature (Industrial) | -40C to +100C | — |
| Encapsulado | 144-pin EQFP with exposed pad (22 x 22 mm) | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad |
| Tipo de montaje | Surface Mount | Surface Mount |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| On-Chip Termination | Dynamic OCT supported | — |
| Configuration Methods | Active Serial, Passive Serial, JTAG, Fast Passive Parallel | — |
| Nivel MSL | 3 (168 hours) | 3 (per JEDEC J-STD-020) |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 6,272 |
| Configurable Logic Blocks (CLBs) | — | 392 |
| Embedded Memory (RAM) | — | 270 Kbits |
| User Flash Memory | — | 4 Kbits |
| User I/O Pins | — | 91 |
| PLLs (General-Purpose) | — | 2 |
| Core Voltage (VCCINT) | — | 1.0 V to 1.2 V (nominal 1.2 V) |
| Operating Temperature (I7 grade) | — | -40C to +100C (junction) |
| Maximum Operating Frequency | — | Up to 472.5 MHz |
| Configuration Method | — | Serial (EPCS) or JTAG |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |