EP4CE6E22I7N vs EP4CE6E22A7N Comparison
Detailed side-by-side comparison of EP4CE6E22I7N by Intel and EP4CE6E22A7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE6E22I7N | EP4CE6E22A7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV E | — |
| Logic Elements (LEs) | 6,272 | — |
| Configurable Logic Blocks (CLBs) | 392 | — |
| Embedded Memory (RAM) | 270 Kbits | — |
| User Flash Memory | 4 Kbits | — |
| User I/O Pins | 91 | 91 |
| PLLs (General-Purpose) | 2 | — |
| Global Clock Networks | Up to 20 | 10 |
| Process Technology | 60 nm (TSMC low-power) | — |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) | — |
| Operating Temperature (I7 grade) | -40C to +100C (junction) | — |
| Maximum Operating Frequency | Up to 472.5 MHz | — |
| Package | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad | — |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| MSL Level | 3 (per JEDEC J-STD-020) | — |
| RoHS Status | Compliant | Compliant |
| Series | — | Cyclone IV E |
| Logic Elements | — | 6,272 |
| Embedded Memory (bits) | — | 276,480 |
| Embedded Multipliers (18x18) | — | 15 |
| Number of I/O Banks | — | 4 |
| Number of PLLs | — | 2 |
| Process Node | — | 60 nm low power |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Automotive A7 (-40C to +125C junction) |
| Package Type | — | 144-pin EQFP (E22) with exposed pad |
| Configuration Modes | — | JTAG, AS, PS, FPP |