EP4CE6E22I7N vs EP4CE6E22A7N Comparación
Comparación detallada lado a lado de EP4CE6E22I7N por Intel y EP4CE6E22A7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6E22I7N | EP4CE6E22A7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,85 | $17,40 |
| Family | Cyclone IV E | — |
| Logic Elements (LEs) | 6,272 | — |
| Configurable Logic Blocks (CLBs) | 392 | — |
| Embedded Memory (RAM) | 270 Kbits | — |
| User Flash Memory | 4 Kbits | — |
| User I/O Pins | 91 | 91 |
| PLLs (General-Purpose) | 2 | — |
| Global Clock Networks | Up to 20 | 10 |
| Process Technology | 60 nm (TSMC low-power) | — |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) | — |
| Operating Temperature (I7 grade) | -40C to +100C (junction) | — |
| Maximum Operating Frequency | Up to 472.5 MHz | — |
| Encapsulado | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | Compliant | Compliant |
| Series | — | Cyclone IV E |
| Logic Elements | — | 6,272 |
| Embedded Memory (bits) | — | 276,480 |
| Embedded Multipliers (18x18) | — | 15 |
| Number of I/O Banks | — | 4 |
| Number of PLLs | — | 2 |
| Process Node | — | 60 nm low power |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Automotive A7 (-40C to +125C junction) |
| Package Type | — | 144-pin EQFP (E22) with exposed pad |
| Configuration Modes | — | JTAG, AS, PS, FPP |