EP4CGX110CF23C8N vs EP4CGX110DF31C8N Comparison

Detailed side-by-side comparison of EP4CGX110CF23C8N by Intel and EP4CGX110DF31C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX110CF23C8N EP4CGX110DF31C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $170.45 $325.00
Family Cyclone IV GX Cyclone IV GX
Logic Elements 109,424 109,424
Logic Array Blocks (LABs) 6,839 6,839
Embedded Memory (bits) 5,621,760 —
User I/O Count 270 —
Transceivers 4 channels 8 high-speed transceivers up to 3.125 Gbps
Transceiver Data Rate (max) 3.125 Gbps —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: DSP block count] —
Process Node 60 nm —
Core Voltage 1.2 V —
Speed Grade C8 8
Operating Temperature 0 C to 85 C (commercial) —
Package 484-ball FBGA (F23) 896-ball FineLine BGA (F31), 31 mm
Mounting Type Surface Mount (BGA) —
RoHS Status Compliant Compliant
Lead-Free Yes —
MSL Level 3 —
Configuration Method Quartus Prime / JTAG / Active Serial —
Embedded Memory Bits — 5,621,760 (approximately 702 Kbits)
Embedded Memory Blocks — M9K blocks, 9-bit parity
DSP Blocks (18x18 Multipliers) — 264 multipliers
Maximum User I/Os — 475
I/O Banks — 8
PLLs — 4 general-purpose PLLs
PCI Express Hard IP — PCIe Gen1/Gen2 x1/x2/x4
Core Supply Voltage — 1.2 V
Process Technology — 60 nm low-power CMOS
Operating Temperature (Commercial) — 0C to 85C
Configuration — SRAM-based, supports AS, PS, JTAG, FPP

Datasheets & Resources

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