EP4CGX110CF23C8N vs EP4CGX110DF31C8N Vergleich
Detaillierter Direktvergleich von EP4CGX110CF23C8N von Intel und EP4CGX110DF31C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110CF23C8N | EP4CGX110DF31C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $170,45 | $325,00 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | 6,839 |
| Embedded Memory (bits) | 5,621,760 | — |
| User I/O Count | 270 | — |
| Transceivers | 4 channels | 8 high-speed transceivers up to 3.125 Gbps |
| Transceiver Data Rate (max) | 3.125 Gbps | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Process Node | 60 nm | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C8 | 8 |
| Betriebstemperatur | 0 C to 85 C (commercial) | — |
| Gehäuse | 484-ball FBGA (F23) | 896-ball FineLine BGA (F31), 31 mm |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | 3 | — |
| Configuration Method | Quartus Prime / JTAG / Active Serial | — |
| Embedded Memory Bits | — | 5,621,760 (approximately 702 Kbits) |
| Embedded Memory Blocks | — | M9K blocks, 9-bit parity |
| DSP Blocks (18x18 Multipliers) | — | 264 multipliers |
| Maximum User I/Os | — | 475 |
| I/O Banks | — | 8 |
| PLLs | — | 4 general-purpose PLLs |
| PCI Express Hard IP | — | PCIe Gen1/Gen2 x1/x2/x4 |
| Core Supply Voltage | — | 1.2 V |
| Process Technology | — | 60 nm low-power CMOS |
| Operating Temperature (Commercial) | — | 0C to 85C |
| Configuration | — | SRAM-based, supports AS, PS, JTAG, FPP |