EP4CGX110DF31C8N vs EP4CGX110CF23C8N Comparison
Detailed side-by-side comparison of EP4CGX110DF31C8N by Intel and EP4CGX110CF23C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX110DF31C8N | EP4CGX110CF23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $325.00 | $170.45 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | 6,839 |
| Embedded Memory Bits | 5,621,760 (approximately 702 Kbits) | — |
| Embedded Memory Blocks | M9K blocks, 9-bit parity | — |
| DSP Blocks (18x18 Multipliers) | 264 multipliers | — |
| Maximum User I/Os | 475 | — |
| I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | — |
| Transceivers | 8 high-speed transceivers up to 3.125 Gbps | 4 channels |
| PCI Express Hard IP | PCIe Gen1/Gen2 x1/x2/x4 | — |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | — |
| Package | 896-ball FineLine BGA (F31), 31 mm | 484-ball FBGA (F23) |
| Operating Temperature (Commercial) | 0C to 85C | — |
| Speed Grade | 8 | C8 |
| Configuration | SRAM-based, supports AS, PS, JTAG, FPP | — |
| RoHS Status | Compliant | Compliant |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Core Voltage | — | 1.2 V |
| Operating Temperature | — | 0 C to 85 C (commercial) |
| Mounting Type | — | Surface Mount (BGA) |
| Lead-Free | — | Yes |
| MSL Level | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |