EP4CGX110DF31C8N vs EP4CGX110CF23C8N Comparación
Comparación detallada lado a lado de EP4CGX110DF31C8N por Intel y EP4CGX110CF23C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110DF31C8N | EP4CGX110CF23C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $325,00 | $170,45 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | 6,839 |
| Embedded Memory Bits | 5,621,760 (approximately 702 Kbits) | — |
| Embedded Memory Blocks | M9K blocks, 9-bit parity | — |
| DSP Blocks (18x18 Multipliers) | 264 multipliers | — |
| Maximum User I/Os | 475 | — |
| I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | — |
| Transceivers | 8 high-speed transceivers up to 3.125 Gbps | 4 channels |
| PCI Express Hard IP | PCIe Gen1/Gen2 x1/x2/x4 | — |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | — |
| Encapsulado | 896-ball FineLine BGA (F31), 31 mm | 484-ball FBGA (F23) |
| Operating Temperature (Commercial) | 0C to 85C | — |
| Speed Grade | 8 | C8 |
| Configuration | SRAM-based, supports AS, PS, JTAG, FPP | — |
| Estado RoHS | Compliant | Compliant |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Core Voltage | — | 1.2 V |
| Temperatura de funcionamiento | — | 0 C to 85 C (commercial) |
| Tipo de montaje | — | Surface Mount (BGA) |
| Lead-Free | — | Yes |
| Nivel MSL | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |