EP4CGX150CF23I6N vs EP4CGX110CF23C8N Comparison

Detailed side-by-side comparison of EP4CGX150CF23I6N by Intel and EP4CGX110CF23C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX150CF23I6N EP4CGX110CF23C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Cyclone IV GX Cyclone IV GX
Logic Elements 149760 109,424
Embedded Memory 6635520 bits (6.6 Mbit) —
User I/Os 270 (per DigiKey listing) - 720 per family datasheet max —
Number of Pins 484 —
Package Type FBGA (FineLine Ball Grid Array) —
Process Technology 60 nm —
Core Voltage 1.2 V 1.2 V
Transceiver Channels 8 (up to 3.125 Gbps) —
PLLs 4 —
18x18 Multipliers Up to 360 —
Memory Blocks M9K (9 Kbit each) —
Configuration Modes JTAG, AS, PS, FPP —
Operating Temperature -40C to +100C (Industrial) 0 C to 85 C (commercial)
Speed Grade 6 C8
RoHS Status Compliant Compliant
Mounting Type Surface Mount Surface Mount (BGA)
Hard IP Blocks PCIe Gen1 (x1/x2/x4), memory controller —
Logic Array Blocks (LABs) — 6,839
Embedded Memory (bits) — 5,621,760
User I/O Count — 270
Transceivers — 4 channels
Transceiver Data Rate (max) — 3.125 Gbps
DSP Blocks (18x18 multipliers) — [DATA_NEEDED: DSP block count]
Process Node — 60 nm
Package — 484-ball FBGA (F23)
Lead-Free — Yes
MSL Level — 3
Configuration Method — Quartus Prime / JTAG / Active Serial

Datasheets & Resources

Browse All Products Create BOM Request Quote