EP4CGX150CF23I6N vs EP4CGX110CF23C8N Comparación
Comparación detallada lado a lado de EP4CGX150CF23I6N por Intel y EP4CGX110CF23C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX150CF23I6N | EP4CGX110CF23C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $175,80 | $170,45 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 149760 | 109,424 |
| Embedded Memory | 6635520 bits (6.6 Mbit) | — |
| User I/Os | 270 (per DigiKey listing) - 720 per family datasheet max | — |
| Número de pines | 484 | — |
| Package Type | FBGA (FineLine Ball Grid Array) | — |
| Process Technology | 60 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Transceiver Channels | 8 (up to 3.125 Gbps) | — |
| PLLs | 4 | — |
| 18x18 Multipliers | Up to 360 | — |
| Memory Blocks | M9K (9 Kbit each) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0 C to 85 C (commercial) |
| Speed Grade | 6 | C8 |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Hard IP Blocks | PCIe Gen1 (x1/x2/x4), memory controller | — |
| Logic Array Blocks (LABs) | — | 6,839 |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceivers | — | 4 channels |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Encapsulado | — | 484-ball FBGA (F23) |
| Lead-Free | — | Yes |
| Nivel MSL | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |