EP4SGX360HF35C2 vs EP4SGX360HF35C3N Comparison
Detailed side-by-side comparison of EP4SGX360HF35C2 by Intel and EP4SGX360HF35C3N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP4SGX360HF35C2 - Stratix IV GX FPGA, 353K LEs, 35x35mm FCBGA | Intel
EP4SGX360HF35C2 β Active
Specification Comparison
| Parameter | EP4SGX360HF35C2 | EP4SGX360HF35C3N |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9,750.00 | $1,180.00 |
| Series | Stratix IV GX | β |
| Family | Stratix IV GX FPGA | Stratix IV GX |
| Logic Elements (LEs) | 353,600 | β |
| LABs/CLBs | 14,144 | β |
| Number of I/O | 564 (max 532 user I/O) | β |
| Embedded Memory (bits) | 23,105,536 | β |
| Number of Logic Cells | 353,600 | β |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Transceivers | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) | 8 channels up to 8.5 Gbps |
| Package Type | 1152-pin FC-FBGA | β |
| Package Code | HF35 (35x35 mm, 1.0 mm pitch) | β |
| Mounting Type | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (commercial) | [DATA_NEEDED: operating temperature grade] |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Configuration | JTAG / Active Serial (external config device) | β |
| Design Tool | Quartus II / Quartus Prime | β |
| Logic Elements (LE) | β | 353,600 |
| Adaptive Logic Modules (ALM) | β | [DATA_NEEDED: ALM count] |
| LABs / CLBs | β | 14,144 |
| User I/Os | β | 564 |
| Total Embedded Memory | β | 23,105,536 bits |
| DSP Blocks (9-bit Γ 9-bit multipliers) | β | [DATA_NEEDED: DSP block count] |
| Package | β | 1152-ball FCBGA (HF35), 35 mm Γ 35 mm |
| Tray Standard Quantity | β | [DATA_NEEDED: tray qty] |