EP4SGX360HF35C2 vs EP4SGX360HF35C3N Vergleich
Detaillierter Direktvergleich von EP4SGX360HF35C2 von Intel und EP4SGX360HF35C3N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360HF35C2 | EP4SGX360HF35C3N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9.750,00 | $1.180,00 |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX FPGA | Stratix IV GX |
| Logic Elements (LEs) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Number of I/O | 564 (max 532 user I/O) | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Cells | 353,600 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Transceivers | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) | 8 channels up to 8.5 Gbps |
| Package Type | 1152-pin FC-FBGA | — |
| Package Code | HF35 (35x35 mm, 1.0 mm pitch) | — |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +85C (commercial) | [DATA_NEEDED: operating temperature grade] |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Configuration | JTAG / Active Serial (external config device) | — |
| Design Tool | Quartus II / Quartus Prime | — |
| Logic Elements (LE) | — | 353,600 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| LABs / CLBs | — | 14,144 |
| User I/Os | — | 564 |
| Total Embedded Memory | — | 23,105,536 bits |
| DSP Blocks (9-bit × 9-bit multipliers) | — | [DATA_NEEDED: DSP block count] |
| Gehäuse | — | 1152-ball FCBGA (HF35), 35 mm × 35 mm |
| Tray Standard Quantity | — | [DATA_NEEDED: tray qty] |