EP4SGX530HH35I3N vs EP4SGX530HH35C4 Comparison
Detailed side-by-side comparison of EP4SGX530HH35I3N by Intel and EP4SGX530HH35C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX530HH35I3N | EP4SGX530HH35C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3,200.00 | $3,120.00 |
| Family | Stratix IV GX | β |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 | 21,248 LABs / 212,480 equivalent LEs |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 |
| Logic Blocks / LABs | 21,248 | β |
| Maximum User I/Os | 564 | β |
| DSP Blocks | 1,024 (18x18 multipliers) | [DATA_NEEDED: block count for this density] |
| Transceivers | 24 channels | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| Transceiver Data Rate (max) | 8.5 Gbps | β |
| PLLs | 8 (fractional support) | 8 fractional PLLs |
| Operating Temperature | -40C to +85C (industrial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Internal Frequency (max) | 800 MHz | β |
| Package | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | β |
| MSL Level | 3 | MSL3 (per BGA package standard) |
| Process Node | 40 nm | β |
| Series | β | Stratix IV GX |
| Maximum User I/O Pins | β | 564 |
| Process Technology | β | 40 nm |
| Core Supply Voltage | β | 0.9 V |
| Speed Grade | β | HH35 |