EP4SGX530HH35I3N vs EP4SGX530HH35C4 Vergleich
Detaillierter Direktvergleich von EP4SGX530HH35I3N von Intel und EP4SGX530HH35C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX530HH35I3N | EP4SGX530HH35C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.200,00 | $3.120,00 |
| Family | Stratix IV GX | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 | 21,248 LABs / 212,480 equivalent LEs |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 |
| Logic Blocks / LABs | 21,248 | — |
| Maximum User I/Os | 564 | — |
| DSP Blocks | 1,024 (18x18 multipliers) | [DATA_NEEDED: block count for this density] |
| Transceivers | 24 channels | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PLLs | 8 (fractional support) | 8 fractional PLLs |
| Betriebstemperatur | -40C to +85C (industrial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Internal Frequency (max) | 800 MHz | — |
| Gehäuse | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | 3 | MSL3 (per BGA package standard) |
| Process Node | 40 nm | — |
| Series | — | Stratix IV GX |
| Maximum User I/O Pins | — | 564 |
| Process Technology | — | 40 nm |
| Core Supply Voltage | — | 0.9 V |
| Speed Grade | — | HH35 |